Organoclay for PU Adhesives in Automotive Assembly

Organoclay for PU Adhesives in Automotive Assembly | High-Performance Rheology

Improve PU adhesive performance in automotive assembly with Camp-Shinning organoclay. Ensures heat stability, smooth extrusion, anti-sag control, and reliable assembly line performance.
Automotive assembly demands PU adhesives that perform under high temperature, vibration, and mechanical stress.

Camp-Shinning organoclay delivers stable viscosity, strong thixotropy, and exceptional filler suspension. It ensures consistent extrusion, smooth application, and reliable vertical hold in automotive bonding and sealing processes.

Manufacturers choose our organoclay for heat resistance, shear stability, and long-term anti-settling performance—key for windshield bonding, panel seam sealing, and structural adhesive applications.

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⭐ FAQ – Organoclay for PU Adhesives

Why use organoclay in PU automotive adhesives?
It stabilizes viscosity, prevents sag, and ensures smooth extrusion.

Does it maintain performance under heat?
Yes. Designed to withstand high-temperature assembly environments.

Can it improve vertical hold during panel bonding?
Absolutely. Strong thixotropy prevents adhesive slip.

Is it compatible with automated assembly lines?
Yes, it supports robotic dispensing with consistent flow.

How does organoclay affect curing?
It does not interfere with PU curing chemistry.

What dosage is recommended for PU automotive adhesives?
Typically 0.5–2%, depending on adhesive formulation and viscosity targets.

⭐ USP – Organoclay for PU Adhesives

High-temperature stability for automotive applications

Anti-sag and shear-resistant thixotropy

Smooth extrusion and precise dispensing

Consistent batch-to-batch performance

Direct factory supply with technical support