High-Yield Organoclay for Adhesives with Low Dosage

High-Yield Organoclay for Adhesives | Maximum Rheology at Low Dosage

High-yield organoclay delivering strong thixotropy and viscosity control in adhesives with minimal loading. Optimized for cost-effective formulation design.

Increasing additive levels to fix rheology problems often leads to higher costs and processing issues.

CP-720A is engineered for high rheological efficiency, allowing formulators to achieve targeted viscosity and sag resistance with significantly lower dosage compared to conventional fillers.

Lower usage not only reduces raw material cost, but also preserves adhesive clarity, bonding strength, and processing flexibility—making CP-720A a smart choice for performance-driven formulations.

Optimize your adhesive formulation with a high-yield organoclay designed to do more with less.

FAQ – High-Yield Organoclay for Adhesives

Q1: What makes CP-720A “high-yield”?
Its strong network-forming capability delivers effective rheology control at lower concentrations.

Q2: Can it be used for post-adjusting viscosity?
Yes. CP-720A can be added during later production stages to fine-tune viscosity.

UPS – High-Yield Organoclay for Adhesives

High rheological efficiency

Reduced additive loading

Maintains adhesive clarity and strength

Cost-effective formulation solution